INTEL Corporation CEO Brian Krzanich unveiled on Tuesday at Mobile World Congress in Barcelona, Spain a series of mobile platforms including the company's new low-cost system-on-chip (SoC) for phones, phablets and tablets, a global LTE solution, innovative personal computing experiences, and a range of customers for mobile device and network infrastructure offerings. With technologies that span silicon, software and security, Krzanich said Intel was one of the few companies able to deliver solutions end-to-end, for devices, the network and the cloud. The announcements include the Intel Atom x3 processor series, Intel's first integrated communications SoC solution for the growing value and entry device markets, and the five-mode Intel XMM 7360 LTE Advanced solution, designed for performance and worldwide coverage. In addition, Krzanich highlighted joint efforts with Alcatel-Lucent, Ericsson and Huawei to address the demand for new telecommunications, cloud and data center services, improve network efficiencies, and accelerate the industry's move toward a software-defined infrastructure. Krzanich reiterated that Samsung Galaxy S6 and S6 Edge users will have the latest anti-malware solution from McAfee VirusScan Mobile technology built into and activated on their devices. “The evolution of the mobile landscape and growth of smart, connected devices has led to increased demand for more connectivity and real-time, protected data on those devices,” said Krzanich. “All of these factors are driving a transformation of the network to accelerate the delivery of new personal computing experiences, services and capabilities in a safe and secure manner. Intel is one of the only companies in the world that can provide solutions end-to-end for the full spectrum of mobility.” Intel introduced the Intel Atom x3 processor series (formerly code-named “SoFIA”), Intel's first integrated communications platform for entry and value tablets, phablets and smartphones. Combining 64-bit multi-core Intel Atom processors together with 3G or 4G LTE connectivity, the integrated communications SoC combines the applications processor, image sensor processor, graphics, audio, connectivity and power management components in a single system chipset. This integration allows device manufacturers to deliver full-featured tablets, phablets and smartphones at affordable price points for the rapidly growing entry and value market segments. Intel is bringing the benefits of integrated Intel architecture and wireless communications to customers, including the China technology ecosystem, with greater velocity. Twenty companies, including ASUS* and Jolla*, have committed to delivering Intel Atom x3 designs. Rounding out its mobile portfolio that scales from the entry to performance segments, Intel also introduced its first 14nm Intel® Atom™ SoC, the Intel Atom x5 and x7 processor series (formally code-named “Cherry Trail”) for next-generation tablets and small-screen 2 in 1s. Offering 64-bit support for Windows* and Android*, Intel Gen 8 graphics, and an option to pair with next-generation LTE Advanced connectivity, the Intel Atom x5 and x7 processor series will power a range of mainstream to premium devices. The processors are also “conflict-free1,” meaning that these products do not contain minerals (tin, tantalum, tungsten and/or gold) that are inadvertently funding human rights violations in the Democratic Republic of the Congo. Customers, including Acer*, ASUS, Dell*, HP*, Lenovo* and Toshiba*, have already committed to deliver devices on this platform. The first devices are expected to be in the market in the first half of this year. Intel also announced its third-generation five-mode, LTE Advanced Category 10 modem. The Intel XMM 7360 supports 3x carrier aggregation and download speeds up to 450 Mbps. Its compact size and power efficiency enable the Intel XMM 7360 to accommodate a wide range of form factors, from smartphones and phablets to tablets and PCs. It also expands Intel's portfolio of LTE solutions. — SG
